The FEHONDA 3.0mm Thermal Pad is a high-performance soft thermal interface material designed to improve heat transfer between electronic components and their cooling surfaces. Its high thermal conductivity and excellent compressibility allow it to conform to uneven surfaces and effectively fill thermal gaps.

Key Specifications

• Thickness: 3.0mm
• Dimensions: 85 × 45mm
• Thermal Conductivity: 12.8W/m·K
• Material: Soft Thermal Pad
• Brand: FEHONDA

Recommended Applications

Ideal for thermal management of:

• GPU and graphics card components
• VRAM and memory chips
• VRM components
• Desktop PCs and laptops
• Gaming consoles and other electronic devices
• Applications requiring a 3.0mm thermal interface pad

Key Features

• 12.8W/m·K thermal conductivity for efficient heat transfer
• Soft and highly compressible material
• Conforms well to uneven contact surfaces
• Designed to fill thermal gaps effectively
• Suitable for applications requiring a 3mm thermal pad
• Helps improve thermal contact between components and heatsinks

Important: Always verify the required thermal pad thickness before installation. Using an incorrect thickness may result in poor contact between the component and heatsink and can affect thermal performance.