Fehonda Thermal Pad 0.75mm 15W – 85×45mm

Short Description

550EGP

Termal Pad Conductive 15w/m.k

12.8W/mK THERMAL CONDUCTIVITY: FEHONDA thermal pad cpu formulated with high-content premium high thermal conductivity fillers. It is ultra-soft and molds perfectly to the contact surface; the excellent compressibility ensures filling the tight gap for effectively lowering temperature in seconds.